Our company boasts a state-of-the-art optoelectronic hybrid integrated device packaging and testing center,occupying an area of over 700 square meters,with an internal Class 10,000 cleanroom spanning approximately 300 square meters. We possess advanced micrometer-level technology,enabling precise assembly and processing of optoelectronic hybrid devices,including bonding,eutectic welding,chip adhesion,coupling,and sealing processes.
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